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ViArrays – Analog/Mixed-Signal Circuit IP
Radiation-Hardened &
Tolerant Integrated Solutions
Rad-Hard by Process and
Rad-Hard by Design
Radiation-Hardened
ViArray Technology and Qualification
ViArrays can be completely configured with a single via-layer, while leaving underlying radiation-assured resources unchanged, eliminating the need for requalification.
The single mask configurability of TMD’s analog/mixed- signal fabric directly supports the “Qualification by Similarity” concept, resulting in a cost-effective solution to the qualification challenges faced by the aerospace and defense industry. All of TMD’s ViArrays are qualified to MIL-PRF-38535. This means, regardless of the design put on the ViArray, the resulting chip will still meet qualification requirements.
TMD Rad-Hard
ViArray™ Advantages
Relevant Radiation Tolerant and Hardened Mixed-Signal IP
Triad Micro Devices Solutions for
Emerging Chiplet Applications
Level Shifting and
Protocol Translation
Analog Front End
Sensor Interfaces
Level Shifting and
Protocol Translation
Analog Front End
Sensor Interfaces
Power Management
Test Coverage
Addressing the Unknowns
Chiplet systems are complex, heterogenous, and designed to address challenging real-world problems. The likelihood of encountering unknown issues during development is high, whether in the form of bugs or late feature requests. In these cases, it may be prohibitively expensive to respin a Deep Submicron (DSM) chiplet. However, ViArrays offer a timely and cost-effective means to address these challenges.